Research Center Profile
Founded under the leadership of Researcher Yang Jianqun, the center brings together national-level talents. It boasts a complete pilot-scale production line covering semiconductor device and integrated-circuit design, packaging, screening and testing. Equipped with state-of-the-art R&D laboratories for electronic materials, the center is capable of developing and supplying four categories of electronic-material products: potting materials, silver pastes, protective materials and plastic-encapsulation materials.
Core Technologies
Starting with the characterization of radiation-induced defect generation and evolution, the center has uncovered radiation-damage mechanisms, and developed integrated structural-process radiation-hardening and simulation technologies based on quantitative control over radiation-damage defects.
In partnership with Heilongjiang Institute of Atomic Energy, the center can perform total-dose irradiation tests and electron-beam irradiation tests for semiconductor devices, as well as evaluation of irradiation-defect effects. Environmental-stress testing services: high-temperature storage, temperature cycling, high-low-temperature shock, hot-humid testing, salt-spray testing and other related tests. Mechanical-stress testing services: mechanical vibration, shock, constant acceleration, collision and other related tests.
Customized design of epoxy resins via flexible molecular design-synthesis technologies, surface-interface design and modification of micro-nano particles, and uniform micro-nano dispersion composite technologies; large-scale production realized through fine-structure construction and quality-control technologies during mass-manufacturing processes.
